需要更多更詳細(xì)的應(yīng)用來分析判斷單片集成或者共封集成的優(yōu)劣
Source: Kevin J. Chen, Oliver Häberlen, Alex Lidow, Chun lin Tsai, Tetsuzo Ueda, Yasuhiro Uemoto and Yifeng Wu, GaN-on-Si Power Technology:, Devices and Applications IEEE
TRANSACTIONS ON ELECTRON DEVICES, VOL. 64, NO. 3, MARCH 2017