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Technical Article
氮化鎵DFN封裝散熱
Release date:2023-04-12
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Category:Technical Article
Views:490次
和硅MOS管一樣,DFN封裝的氮化鎵器件通過底部散熱盤散熱。氮化鎵器件的散熱盤通常和器件的硅襯底(以及源極)接觸
在PCB板里面通常使用銅柱來將器件的熱量傳導至PCB板的底部,并可以通過在PCB板底部外加散熱片來減小從結(jié)到環(huán)境的熱阻(Rthja)
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