X
Chip Design: Chip design plays a pivotal role as the first step in chip manufacturing, determining the structure and performance of the device.
Power devices focus on providing power conversion and circuit control solutions in high-voltage and high-current application environments. There are a variety of solutions for power devices in different application environments. Taking SiC MOSFETs and GaN HEMT as examples, SiC MOSFETs perform particularly outstanding in the fields of medium and high voltage (such as 1200V, 1700V, etc.) and medium and high power (2000W-1MW), while GaN HEMT is more suitable for small and medium power fields, which can increase the power density by increasing the frequency. At the same time, for power devices, high power, low loss and low cost have always been the core goals of research and development. Power device engineers need to propose a reasonable design scheme according to the application requirements. Adjusting device structure based on device principle, so as to effectively improve the device performance, reduce energy loss and cost of the device.
X-IPM provides matching design schemes and solutions for the application scenarios and performance requirements of power devices.
Wafer fabrication: As a core step in chip manufacturing, wafer fabrication determines whether a chip can be transformed from concept to reality.
The power device manufacturing process generally includes material growth - epitaxial preparation - wafer processing - CP testing. Because power devices require special processes, they often face many challenges, such as epitaxy preparation and trench structure etching of GaN and SiC. The wafer processing capability has a direct impact on the performance of the device, so the power device needs to match the existing process in the manufacturing process for processing and manufacturing, strictly control the process flow, and complete the chip manufacturing through the synergy of design and fabrication process.
X-IPM cooperates with top-notch semiconductor industry foundries to develop high-quality chip solutions and shorten the R&D cycle time.
Assembly and test: As the finishing step of chip manufacturing, packaging and testing determine the quality level of the final chip products.
The packaging is to protect the chip from being affected by the external environment and provide a good and stable working environment. Thus, good packaging can maintain the original performance of the device. At the same time, packaging plays a non-negligible role in reducing the parasitic parameters (inductance, capacitance, etc.) of the device and solving the heat dissipation problem of the device after packaging. A final test is performed to verified the parameters of the chips and determine whether they meet the expectations of the designers and the end users.
X-IPM cooperates with domestic advanced OSAT to ensure product shipment rate and reliability.
